GIGABYTE Technologies INC., a leading manufacturer of motherboards and graphics cards today is pleased to introduce their revolutionary Ultra Durable 3 Classic technology, featuring ounces of copper for both the Power and Ground layers to a dramatically lower system temperature, improved energy efficiency and enhanced stability for overclocking on a wide range of current AMD motherboards.
GIGABYTE once again leads the motherboard industry for the highest quality, most innovative motherboard design with the launch of their latest Ultra Durable 3 Classic technology. Equipped on the latest GIGABYTE AMD chipset-based solutions including the AMD 790GX, 790X, 780G and 770, GIGABYTE Ultra Durable 3 Classic motherboards feature double the amount of copper for the Power and Ground layers of the PCB. Most traditional motherboard designs utilize a single ounce of copper for each layer, whereas GIGABYTE’s ultra Durable 3 motherboards feature 2 ounces per layer.
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